Microstructure and properties of Al/Si/SiC composites for electronic packaging  

电子封装用Al/Si/SiC复合材料的显微组织与性能(英文)

作　　者：朱晓敏[1] 于家康[1] 王新宇[1] 

机构地区：[1]西北工业大学凝固技术国家重点实验室,西安710072

出　　处：《Transactions of Nonferrous Metals Society of China》2012年第7期1686-1692,共7页中国有色金属学报（英文版）

基　　金：Project (60776019) supported by the National Natural Science Foundation of China;Project (61-TP-2010) supported by the Research Fund of the State Key Laboratory of Solidification Processing (NWPU),China

摘　　要：The Al/Si/SiC composites with medium volume fraction for electronic packaging were fabricated by gas pressure infiltration.On the premise of keeping the machinability of the composites,the silicon carbide particles,which have the similar size with silicon particles（average 13 μm）,were added to replace silicon particles of same volume fraction,and microstructure and properties of the composites were investigated.The results show that reinforcing particles are distributed uniformly and no apparent pores are observed in the composites.It is also observed that higher thermal conductivity（TC） and flexural strength will be obtained with the addition of SiC particles.Meanwhile,coefficient of thermal expansion（CTE） changes smaller than TC.Models for predicting thermal properties were also discussed.Equivalent effective conductivity（EEC） was proposed to make H-J model suitable for hybrid particles and multimodal particle size distribution.采用气压浸渗法制备中体积分数电子封装用 Al/Si/SiC 复合材料。在保证加工性能的前提下,用与 Si 颗粒相同尺寸(13 μm)的 SiC 替代相同体积分数的硅颗粒制得复合材料,并研究其显微组织与性能。结果显示,颗粒分布均匀,未发现明显的孔洞。随着 SiC 的加入,强度和热导率将得到明显提高,但热膨胀系数变化较小,对使用影响也不大。讨论几种用于预测材料热学性能的模型。新的当量有效热导被引入后,H-J 模型将适用于混杂和多颗粒尺寸分布的情况。

关 键 词：Al/Si/SiC composite electronic packaging thermal properties flexural strength 

分 类 号：TB333[一般工业技术—材料科学与工程]