电镀级活性氧化铜粉的制备  

Preparation of plating-grade active copper oxide powder

作　　者：符飞燕[1] 王克军[1] 黄革[1] 周仲承[1] 高四[1] 刘荣胜[1] 

机构地区：[1]中国人民解放军61699部队

出　　处：《电镀与涂饰》2012年第9期8-11,共4页Electroplating & Finishing

摘　　要：以纯铜片为原料,经过碳酸氢铵–氨水溶铜、常压脱氨、焙烧等3个阶段,得到了活性氧化铜粉。用扫描电镜(SEM)、X射线衍射(XRD)、电感耦合等离子体原子发射光谱(ICP-AES)等方法对所得活性氧化铜粉的性能进行了表征。结果表明,采用该方法得到的活性氧化铜粉纯度达到99%以上,金属杂质含量和溶解速率完全符合电镀级氧化铜粉的要求,可以直接用于线路板的电镀铜。Active copper oxide powder was prepared with pure copper sheet as raw material through the following steps： （1） dissolution in NH4HCO3-NH3.H2P solution; （2） removal of ammonia; and （3） roasting. The properties of the active copper oxide powder were characterized by scanning electron microscopy （SEM）, X-ray diffraction （XRD）, and inductively coupled plasma atomic emission spectroscopy （ICP-AES）. The results showed that the active copper oxide powder obtained has a purity of 〉99%, and satisfactory metallic impurity content and dissolution speed, being suitable for application to electroplating. Hence it can be used directly in copper plating of printed circuit boards.

关 键 词：氧化铜 制备 表征 印制电路板 酸性镀铜 

分 类 号：TQ153.14[化学工程—电化学工业] TQ150.4