改性甲壳胺添加剂在钠盐镀锌中的应用  

MODIFIED CHITOSAN ADDITIVE FOR Zn SODIUM CHLORIDE ELECTROPLATING

作　　者：杨晓静[1] 钱倚剑[1] 于文霞[1] 王战群 符晓乔 

机构地区：[1]海南大学理工学院,海口570228

出　　处：《腐蚀科学与防护技术》2000年第3期141-143,147,共4页Corrosion Science and Protection Technology

摘　　要：利用赫尔槽和金相观测等方法 ,对镀液性能和镀层性能进行了研究 .探讨了改性甲壳胺分子对钠盐镀锌过程的影响 .结果发现改性甲壳胺可作为钠盐镀锌的一种添加剂 ,其镀液及镀层性能优于常用的硫脲及氯锌The possibility of modified chitosan as an additive for Zn sodium chloride electroplating has been studied. The properties of the three plating solutions and the zinc plating layer was compared one another by Hull cell and metallography. The effect of modified chitosamine melocule on znic plating was studied. The results showed that modified chitosan can be used as an additive of Zn sodium chlorid1e electroplating, and the properties of plating solution and plating layer is better than thiourea and Cl\|Zn No.1.

关 键 词：改性甲壳胺 钠盐镀锌 添加剂 

分 类 号：TQ153.15[化学工程—电化学工业]