耐高温交联侧基苯乙炔封端酰亚胺预聚体  

Phenylethynyl-terminated Imide Oligomer of Having Pendent Phenylethynyl Group with Good Thermal Stability

作　　者：杨明[1] 白哲革[2] 周宏伟[2] 陈春海[2] 党国栋[2] 

机构地区：[1]中国航空工业集团北京航空材料研究院,北京100095 [2]吉林大学化学学院,麦克德尔米德实验室,长春130012

出　　处：《高等学校化学学报》2012年第9期2117-2120,共4页Chemical Journal of Chinese Universities

基　　金：国家“九七三”计划项目(批准号:2010CB631100);国家科技支撑计划项目(批准号:2011BAA06B03)资助

摘　　要：合成了含有苯乙炔基的二胺单体3,5-二氨基-4'-苯乙炔苯甲酮(DPEB),并与3,3',4,4'-联苯四酸二酐(s-BPDA)和1,4-双(4'-氨基苯氧基)-2-(苯基)苯(p-TPEQ)进行了缩聚反应,以4-苯乙炔苯酐作为封端剂,合成了交联侧基苯乙炔封端酰亚胺预聚体(n=4).DSC测试结果表明,引入交联侧基后预聚体依然保持着较宽的加工窗口.利用所合成的预聚体在370℃热压1 h制备了热固性薄膜.DMA测试结果表明,引入交联侧基的预聚体树脂具有更高的玻璃化转变温度,并且其储存模量在玻璃化转变后有很好的保持.A diamine monomer 3,5-diamino-4＇-phenylethynylbenzophenone （DPEB） was synthesized and phenylethynyl-terminated imide oligomers having pendent phenylethynyl group （rt = 4） was prepared by the reaction of 3,3＇, 4,4＇-biphenylenetetracarboxylic dianhydride （ s-BPDA ）, DPEB and 2,5-bis （ 4-aminophenoxy）-biphenyl（p-TPEQ）, and end-capped with 4-phenylethynylphthalic anhydride （PEPA）. The imide oli gomer had low Tg and pro, eided wide processing window. The cured films were prepared by molding the oligomer powder at 370 °C for 1 h under pressure. DMA results show tile introduction of pendent phenylethynyl group increases Ts of the cured film and the retention of storage modulus beyond Ts is promoted.

关 键 词：聚酰亚胺 预聚体 苯乙炔 交联侧基 3 5-二氨基-4'-苯乙炔苯甲酮 

分 类 号：O631[理学—高分子化学]