烧结式镍基板电化学浸渍的研究  

Study of Electrochemical Impregnation for Sintered Nickel Plaques

作　　者：唐致远[1] 赵铭[1] 宋改云 薛建军[1] 

机构地区：[1]天津大学化工学院,天津300072

出　　处：《电池》2000年第2期49-52,共4页Battery Bimonthly

摘　　要：对烧结式镍基板的电化学浸渍过程进行了研究。在探讨了电化学浸渍机理的基础上 ,研究了溶液流动状态、电化学浸渍电流密度、溶液 pH值、电化学浸渍时间等各种因素对电化学浸渍的影响 。The process and mechanism of electrochemical impregnation on the sintered nickel plaque were studied.Based on the analysis of mechanism,various factors that affected electrochemical impregnation including fluidity of solution,current density,pH of solution and the impregnating time were discussed.After that the optimum electrochemical impregnation method was proposed.

关 键 词：电化学浸渍 烧结式镍基板 电极 电池 

分 类 号：TM91[电气工程—电力电子与电力传动]