减弱高速PCB过孔影响的方法  

Methods of Descending Effects of Via in High-speed PCB

作　　者：李超[1] 陈少昌[1] 刘任洋[1] 

机构地区：[1]武汉海军工程大学

出　　处：《安全与电磁兼容》2012年第4期57-60,72,共5页Safety & EMC

摘　　要：介绍了过孔的分类与应用,并针对盲孔的阻抗突变作用、通孔的EMI辐射问题,通过仿真方法分析得出:实际电路避开盲孔谐振点即可减弱阻抗突变作用;增加接地过孔,可改变电流的回流路径,减小电路的环路面积即可减弱EMI,并验证了此方法的优越性。The categorization and applications of via were introduced. Aiming at the effect of blind via on abrupt change of impedance as well as the problem of EMI radiation induced by through-hole, the simulation was carried out. The results showed that the resonance points of blind via should be avoided to weaken the abrupt change of impedance. The grounded vias could be added to change re- turning current path, the EMI radiation was attenuated by reducing the loop area. At last, the superiority of this method was verified.

关 键 词：信号完整性 过孔 阻抗突变 电磁干扰 PCB 

分 类 号：TN41[电子电信—微电子学与固体电子学]