表面组装焊点内部应力—应变场的数值模拟(Ⅱ)——焊点失效的主控力学因素  

Finite element analysis of stress strain distribution characteristics in SMT solder joints(Ⅱ) ——Dominant mechanical factor responsible for failure of solder joint

作　　者：钱乙余[1] 马鑫[1] 吉田综仁[2] 

机构地区：[1]哈尔滨工业大学现代焊接生产技术国家重点实验室,哈尔滨150001 [2]广岛大学工学部弹塑性工学研究室

出　　处：《中国有色金属学报》2000年第3期411-415,共5页The Chinese Journal of Nonferrous Metals

摘　　要：温度循环载荷可以在焊点界面处形成足以导致空洞损伤发生的高应力三轴度。针对温度循环载荷下软钎焊焊点界面空洞损伤的失效行为特点 ,结合焊点内部应力—应变场分布特征及其温度历史相关性 ,提出了相对损伤应力这一概念 ,并以此作为温度循环载荷下软钎焊焊点失效的主控力学因素。分析了温度历史不同阶段对焊点失效行为的影响 ,结果表明高温保温阶段焊点内部最容易发生空洞损伤。Interface void damage is the failure characteristic of solder joint under temperature cycling. Based on the distribution feature and temperature history relativity of stress strain field in the solder joint, the concept of relative damage stress was put forward as dominant mechanical factor responsible for the failure of solder joint. Analysis results showed that it is easiest for void damage to occur in the high temperature holding time during temperature cycling history. [

关 键 词：相对损伤应力 主控力学因素 表面组装焊点 

分 类 号：TG404[金属学及工艺—焊接]