烧结温度对硼硅酸盐玻璃/氧化铝复相陶瓷性能的影响  

The influence of sintering temperature on the properties of borosilicate glass/alumina composite ceramics

作　　者：毛兴龙[1] 周洪庆[1] 赵建新[1] 曾凤[1] 朱海奎[1] 

机构地区：[1]南京工业大学材料科学与工程学院,江苏南京210009

出　　处：《电子元件与材料》2012年第10期9-11,15,共4页Electronic Components And Materials

基　　金：江苏省科技支撑资助项目(No.BE2009168);大功率LED封装用高导热LTCC关键材料研究资助项目(No.BE2010194)

摘　　要：采用流延成型工艺制备了硼硅酸盐玻璃/氧化铝陶瓷生瓷带,并经烧结制备了陶瓷试样。研究了烧结温度对所制陶瓷烧结性能、介电性能与微观结构的影响。结果表明:随着烧结温度的升高,所得陶瓷试样的体积密度、烧结收缩和介电常数均先增大后减小;当烧结温度达到850℃时,陶瓷试样中开始析出钙长石晶相;经880℃烧结所得陶瓷性能较佳:体积密度为3.08 g/cm3,在20 MHz下相对介电常数为7.7,介质损耗为2.0×10–4,25～600℃内线膨胀系数为8.3×10–6/℃,满足LTCC基板材料的应用要求。Borosilicate glass/alumina composite ceramics were fabricated by sintering the green tape prepared by tape casting. The effects of sintering temperature on the sintering performance, dielectric properties and microstructure of the ceramics were studied. The results show that the bulk density, sintering shrinkage and permittivity of the prepared ceramics increase first and then decrease with the increase of sintering temperature. When the sintering temperature reaches 850 ℃, anorthite crystals start to be present in the ceramics. Compared with other samples, the ceramics sintered at 880 ℃ exhibits a better performance： a bulk density of 3.08 g/cm^3, a relative permmittivity of 7.7 and a dielectric loss of 2.0 × 10^-4 at 20 MHz, as well as a thermal expansion coefficient （TEC） of 8.3× 10^-6/ ℃ in the range of 25-600 ℃, fulfilling the requirements ofLTCC substrate.

关 键 词：烧结温度 硼硅酸盐玻璃/氧化铝 介电性能 

分 类 号：TM28[一般工业技术—材料科学与工程]