成型温度对环氧树脂基发泡材料发泡行为的影响  

Foaming of Behavior based on Epoxy Resin in Molding Temperature

作　　者：杨金尧[1,2] 于杰[1,2] 王醴均[2] 张纯[1] 

机构地区：[1]贵州大学材料科学与冶金工程学院,贵州贵阳550003 [2]国家复合改性聚合物材料工程技术研究中心,贵州贵阳550014

出　　处：《塑料》2012年第5期40-43,共4页Plastics

基　　金：贵州省工业攻关项目(黔科合GY字[2010]3005号)

摘　　要：采用化学发泡模压成型制备环氧树脂基发泡材料,以不同成型温度下环氧树脂基发泡材料的表观密度、泡孔平均直径、泡孔尺寸分布、泡孔密度的统计和SEM观察,考察成型温度对化学发泡制备环氧树脂基发泡材料发泡行为的影响。结果表明:在一定温度下环氧树脂固化速率与发泡剂的分解速率相当时,环氧树脂固化与泡孔形核、长大、定型的同步协调性较好,实验范围内,当成型温度为160℃,可获得泡孔尺寸为78μm、泡孔密度为1.23×106个/cm3、泡孔尺寸分布均匀的微孔发泡环氧树脂基材料。The epoxy foam material was prepared by chemical foam molding. Through the SEM observation and statistical parameters of the epoxy foam material＇ s structure under different processing temperature ,the impact of the molding temperature on the foaming behavior of epoxy resin foam material was studied. The results showed when epoxy curing rate and blowing agent decomposition rate of the nucleation in balance at a certain temperature, the synchronous coordination between epoxy curing and cell nucleation was better. The cell size of material would be evenly distributed when molding temperature was 160 C , meanwhile,cell size was 78 μm and cell density was 1.23 x 106 cell/cm3.

关 键 词：成型温度 环氧树脂 泡孔尺寸 泡孔密度 微孔 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]