二甲苯型氰酸酯/环氧树脂固化体系介电性研究  

Study on the dielectric properties of dimethylbenzene-cyanate esters /epoxy resin curing system

作　　者：梁磊[1] 余若冰[1] 张中云[1] 刘胜平[1] 

机构地区：[1]华东理工大学材料科学与工程学院,上海200237

出　　处：《热固性树脂》2012年第5期19-21,共3页Thermosetting Resin

摘　　要：通过介电性能和吸水率测试研究了二甲苯型氰酸酯(DMBPCN)与环氧树脂(EP)不同配比对其共混体系固化物性能的影响。结果表明,随着DMBPCN用量增加,DMBPCN/EP固化物中极性基团减少,介电性能提高。当DMBPCN添加质量分数为90%时,DMBPCN/EP固化物在沸水中浸泡100 h后吸水率仅为0.64%。MBPCN/EP固化体系的耐水性能和介电性能较常用的双酚A氰酸酯/环氧树脂体系高。The effect of different mass ratio of dimethylbenzene - cyanate esters（DMBPCN） to epoxy resin（EP） on the properties of their blends curing products were investigated by the testings of water absorption and dielectric property. The results showed that the dielectric properties of DMBPCN/EP curing systems were improved due to the polar groups of the curing products were decreased with the increasing of DMBPCN content . The moisture absorp- tion of DMBPCN/EP system with DMBPCN content 90% was only 0. 64% after soaking in boiling water for 100 h. The water absorption and dielectric properties of DMBPCN/EP system were better than that of common bisphenol A cyanate ester/epoxy resin system.

关 键 词：环氧树脂 二甲苯型氰酸酯 改性 介电性能 吸水率 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]