户内新型高密度LED显示器件及显示屏的研究  

A Kind of New Type High Density Indoor LED Display Devices and the Display Screen

作　　者：周伯平 姬生祥 

机构地区：[1]石家庄市京华电子实业有限公司,河北石家庄050011

出　　处：《现代显示》2012年第9期209-212,共4页Advanced Display

摘　　要：集成电路具有密度高、引线短、外部接线少、体积小、重量轻、成本低、使用方便等特点,提高了电子设备的可靠性和灵活性,在性能上也优于分立元件。采用集成化方式生产的LED显示器件,采用金属外壳封装工艺,很好地解决了集成模块的散热和均热问题;采用COB生产工艺,像素密度可超过25万点/平方米;集成化封装工艺使LED芯片得到了良好的保护;表面黑化处理工艺使整屏的显示效果更好。采用该新型器件,并结合逐点校正技术制造的显示屏,将校正数据存储在模组中,上电后控制器自动读回校正数据,对画面进行校正处理,很好地消除了模块效应,可以得到完美的显示效果。The character of integrated circuit has the characteristic of high density, short lead, less external connection, small volume, light weight, low cost, using convenient, etc. It can improve the reliability of electronic equipment and flexibility, and its performance is better than division components. Using integrated way of production a LED display device, the metal shell packaging technology, solves the integration module and soaking pit heat. The COB production process, pixel density is more than 250,000 points/square meters. Integrated packaging technology make better protected chip. Surface treatment technology of black the screen display effect is better. Using the new device, and combining point by point correction technology, manufacturing screen, will correct data storage in the module, after power up automatic controller read back calibration data, to the correct picture processing, thoroughly solved the module effect, can get perfect display effect.

关 键 词：高密度 金属外壳 板上芯片 集成化封装 表面黑化 逐点校正 

分 类 号：TN312.8[电子电信—物理电子学]