ENEPIG表面涂覆工艺的可靠性实验分析  

Reliability Analysis of ENEPIG Surface Coating Technology

作　　者：于金伟[1] 

机构地区：[1]潍坊学院,山东潍坊261061

出　　处：《实验室研究与探索》2012年第5期25-27,110,共4页Research and Exploration In Laboratory

基　　金：山东省国际科技合作计划项目(201013);山东省星火计划项目(2011XH06025);国家星火计划项目(2011GA740047);山东省潍坊市科学技术发展计划项目(201001044);山东省高等学校科技计划项目(J12LA57)

摘　　要：在ENEPIG表面涂覆工艺中引入了化学镀钯层,从反应原理上杜绝了镀镍层的氧化,但其实际应用的工艺条件及参数是否具备了可量产的条件,需要用一系列可靠性实验进行验证,以减小量产后的风险系数。提出了一揽子实验方案,包括实验项目、方法、试验所需的仪器设备、评估要求、试验结果及分析等,特别是采用透射电镜对ENEPIG涂覆层与SAC305形成的界面合金共化物进行了剖析,从而验证了所应用的ENEPIG制作工艺成熟可靠,是全能型的表面涂覆工艺,特别适用于金线键合和表面贴装混合组装板等要求高连接可靠性的产品上。The electroless palladium is introduced into the ENEPIG surface coating technology to prevent oxidation of nickel-plated layer from the principle of reaction.However,a series of experiments should be conducted to prove if its process and parameters are fit for practical application in mass production.Therefore,a package of experiments are proposed including experimental projects,methods,instruments and equipment,evaluation requirements,and test results and analysis.The TEM is especially used to conduct in-depth analysis of the interface ally compound of ENEPIG coating layer with SAC305,thereby systematically verifying the reliability of the ENEPIG technology,which is considered as a versatile surface coating technology,particularly suitable for application in gold bonding and surface mount hybrid assembly borad.The ENEPIG surface coating technology is reliable and will replace the current ENIG technology.

关 键 词：化学镀镍化学镀钯与浸金工艺 PCB 表面涂覆 可靠性 实验分析 

分 类 号：TN641.2[电子电信—电路与系统]