新型覆铜箔玻纤布增强聚芳醚腈酮层压板  

Novel Poly(arylene ether nitrile ketone) Copper Clad Laminate

作　　者：王锦艳[1,2] 刘程[1,2] 王守立[1,2] 王勤祎[1,2] 蹇锡高[1,2] 

机构地区：[1]大连理工大学辽宁省高性能树脂工程技术研究中心,辽宁大连116023 [2]大连理工大学高分子材料系,辽宁大连116023

出　　处：《绝缘材料》2012年第4期9-13,共5页Insulating Materials

摘　　要：制备了玻纤布增强含二氮杂萘酮聚芳醚腈(PPENK)覆铜层压板,研究了PPENK树脂含量对覆铜层压板弯曲强度、剥离强度和吸水率的影响,以及偶联剂种类和含量对覆铜层压板弯曲强度和剥离强度的影响,并对覆铜层压板的介电性能、耐锡焊性、阻燃性等进行了测试。结果表明:选用KH-560偶联剂处理玻纤布、KH-550处理铜箔,当PPENK树脂含量为55%时,PPENK覆铜层压板的综合性能最优,在2 GHz下其介电常数为3.6,tanδ为0.002 2,在290℃下耐锡焊性超过120 s,剥离强度为1.6 N/mm。A copper clad laminate（CCL） of glass cloth reinforced poly（arylene ether nitrile） containing phthalazone（PPENK） was prepared.The effects of PPENK resin content on the flexural strength,peel strength and water absorption and the effects of coupling agent type and content on the flexural strength and peel strength of the CCL were studied.The dielectric properties,soldering resistance and flame retardancy of the CCL were tested.The results show that using KH-560 to treat the glass fiber and KH-550 to treat the copper foil,when the PPENK resin content is 55%,the CCL has optimum comprehensive performances.Under condition of 2 GHz,the dielectric constant and dielectric loss is 3.6 and 0.002 2,respectively.The soldering resistance is over 120 s at 290 ℃,and the peel strength attains 1.6 N/mm.

关 键 词：覆铜层压板 聚芳醚腈酮 二氮杂萘酮 弯曲强度 介电性能 表面处理 

分 类 号：TM201.4[一般工业技术—材料科学与工程] TM215.71[电气工程—电工理论与新技术]