电子器件散热片换热特性的数值研究  

A Numerical Simulation Study on Heat transfer characteristics of Electronic device Heat Sinks

作　　者：范伟[1] 李慧君[1] 

机构地区：[1]华北电力大学,保定071003

出　　处：《电子元器件应用》2012年第9期34-36,44,共4页Electronic Component & Device Applications

摘　　要：对三种不同截面形状的散热片,在不同风速和相同加热功率下的换热特性进行数值模拟。得到三种散热片的底面芯片最高温度、传热系数以及压降在不同风速下的变化关系。通过对计算结果的分析可知:三种模型的底面芯片最高温度随着风速的增加而下降,传热系数和压降随着风速的增加而增大,这与相关实验数据的变化趋势一致。提高风速可以有效增强换热效果,但是压降的影响不容忽视。对比三种模型,收缩式散热片模型较另外两种模型具有换热效果好、压降小的优点,可为高热流密度的电子设备冷却方案的设计和改进提供参考。A numerical simulation study is presented on the heat transfer characteristics of three kinds of different section shape of heat sinks,under the circumstances of different air velocity and same power input. Get the relationship of the bottom chip maximum temperature ,heat transfer coefficient and the pressure drop with different air velocity. The analysis on calculating results shows that the bottom chip maximum temperature dropped with air velocity increased, the heat transfer coefficient and the pressure drop increased with air velocity increased of three models,which is in line with the variation tendency of experimental data. Improving the air velocity can effectively enhance the heat transfer effect,but impact of the pressure drop should not be ignored, Comparing the calculating results of three models, it is concluded that the contraction type heat sink is more effective of heat transfer, and lesser pressure drop than the other two models, and also offer a reference for the design and improvement of the Cooling scheme for high heat flux electronic equipment.

关 键 词：电子器件 散热片 换热特性 数值模拟 

分 类 号：TP332[自动化与计算机技术—计算机系统结构]