基于DM60红外热像仪的电路板卡温度测量分析  

Temperature Measurement Analysis of Circuit Boards Based on Infrared Thermography

作　　者：宫明文[1] 李云霞[1] 蒙文[1] 魏新[1] 李达[1] 

机构地区：[1]空军工程大学电讯工程学院,西安710077

出　　处：《科学技术与工程》2012年第27期6923-6926,共4页Science Technology and Engineering

摘　　要：电路板红外测温是热像仪应用领域的一个重要方面,但由于测温过程中影响因素比较复杂,至今没能得到深入应用。对电路板红外测温影响因素进行了理论推导,指出在一般的电路板红外测温中,环境温度和辐射率是影响测温准确性的主要因素。并对这两个因素进行了具体详细的分析。通过DM60热像仪测得的试验数据对分析结果进行验证。利用Matlab对实验数据进行拟合,直观表现出环境温度和辐射率的影响规律,为电路板红外测温的校正提供依据。The board infrared temperature measurement is an important aspect of the infrared thermography applications,but it has failed to get in-depth applications due to the complexity of the influencing factors in the temperature measurement process.The theoretical derivation of the influencing factors of the infrared temperature measurement of the circuit board is given,indicated that the environmental temperature and radiation rate is the main factor affecting the temperature measurement accuracy in the general board of infrared temperature measurement,and analyed the two factors specifically.The results of the analysis using experimental data are verifed.The experimental data are fitted to visually demonstrate the impact of environmental temperature and radiation rate through matlab.The basis for the calibration of infrared temperature measurement of the circuit board is provided.

关 键 词：红外热像仪 电路板卡 温度测量 

分 类 号：TN219[电子电信—物理电子学]