机载电子设备冷却散热技术的发展  

Development on Heat Dissipation Technique of Airborne Electronic Equipment

作　　者：张娅妮[1] 陈菲尔[2] 田沣[1] 

机构地区：[1]中航工业西安航空计算技术研究所,陕西西安710068 [2]北京航空航天大学电子信息工程,北京100191

出　　处：《航空计算技术》2012年第4期113-116,共4页Aeronautical Computing Technique

基　　金：航空科学基金项目资助(20100231)

摘　　要：机载电子设备高性能、高可靠、低成本的发展趋势对冷却散热技术不断提出更高的要求。详细介绍了用于机载电子设备的风冷、液冷以及其他新型冷却散热技术,阐述了各种散热技术的原理和特点,探讨了未来机载电子设备冷却散热技术的发展方向。研究结果表明:液冷必将取代风冷成为机载电子设备的主要冷却散热方式。未来机载电子设备还将采用混合冷却的设计方案,最大限度地发挥电子设备的热性能,提高机载电子设备综合化设计能力。Further Requirements of heat dissipation technique will be presented continuously because of high performance, high reliability and low cost development of Airborne Electronic Equipment. Air cool- ing,liquid cooling and other new- type cooling techniques were introduced detailed in this paper. The principles and characteristics of above- mentioned technique were formulated. The technical development orientation of future airborne electronic- equipment was discussed. The results showed that air cooling will be replaced certainly by liquid cooling. Mixing cooling will be adopted in future airborne electronic equip- ment which display the thermal performance furthest and advance the integrative projected capacity of air- borne electronic equipment.

关 键 词：风冷 液冷 新型冷却 混合冷却 

分 类 号：TP305[自动化与计算机技术—计算机系统结构]