片状硅藻土表面化学镀银工艺及介电性能  

Flake-like Diatomite Coated with Silver by Electroless Plating and Its Dielectric Properties

作　　者：张德远[1] 兰明明[1] 蔡军[1] 

机构地区：[1]北京航空航天大学仿生与微纳生物制造技术研究中心,北京100191

出　　处：《稀有金属材料与工程》2012年第9期1676-1679,共4页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(59975007);国家高技术研究发展计划(2009AA043804);全国优秀博士学位论文作者专项资金(2007B32)

摘　　要：以片状硅藻土为模板,利用化学镀法在其表面包覆银来制备核壳式复合功能微粒。研究化学镀工艺对硅藻土表面银含量和微观形貌的影响,并对镀银硅藻土微粒的介电性能进行分析。结果表明,随着施镀时间和装载量的增大,硅藻土表面银含量随之升高;在银含量为34.65%时,镀层均匀、连续、致密,且硅藻土表面微孔被镀层完全覆盖;镀银硅藻土微粒的介电性能与其表面银含量、镀层质量及体积添加比有关,此外所有样品的介电常数虚部均低于其实部,表明未出现渗漏现象。Flake-like diatomite was used as forming templates to prepare the core-shell functional particles by the electroless silver plating method. The effects of electroless plating process on the silver content and surface morphology of diatomite were discussed. The dielectric properties of silver-coated diatomite particles were also analyzed. The results indicate that the silver content of diatomite increases with increasing plating time and load. At the silver content of 34.65% （mass fraction）, the silver coating is fairly homogeneous, continuous and compact, and the micropores on the surface of diatomite are completely covered by the coating. The dielectric properties of silver-coated diatomite particles are related with silver content, coating morphology and volume concentration. Furthermore, the imaginary parts of dielectric constant of all the samples are lower than the real parts. It shows that all the samples do not exhibit percolation phenomenon.

关 键 词：硅藻土 化学镀银 介电性能 

分 类 号：TQ153.16[化学工程—电化学工业]