高温高残留聚环三膦腈-芳酰胺材料的合成与热性能  

Synthesis and Thermal Properties of High Residual Poly(Cyclotriphosphazene-Aryl Amide) at High Temperature

作　　者：孙金亮[1] 张经毅[1] 郭强[1] 赵正平[1] 聂智军[1] 罗唯力[2] 

机构地区：[1]上海大学材料科学与工程学院,上海201800 [2]上海材料研究所,上海200437

出　　处：《机械工程材料》2012年第10期74-76,共3页Materials For Mechanical Engineering

基　　金：国家自然科学基金资助项目(50975167)

摘　　要：采用苯酚钠和4,4'-二氨基二苯醚亲核取代六氯环三磷腈,生成2,4-二[4'-(4''-氨基苯氧基)苯胺基]四苯氧基环三磷腈(AOPPZ),进而将其与对苯二甲酰氯进行缩聚反应,获得聚环三膦腈-芳酰胺材料(POPA);采用红外光谱仪、核磁共振波谱仪对所合成的AOPPZ和POPA进行结构分析,采用热重分析仪对二者热性能进行测试分析。结果表明:二者中存在苯氧基取代结构,磷腈环上6个氯原子均被取代,后者主链上有聚酰胺结构;AOPPZ在200℃左右开始分解,经600℃热过程固体残留物质量分数高达56.4%;而POPA在220℃开始分解,355℃达到最大分解率,经600℃热过程固体残留物质量分数高达55.6%,属高温高残留材料。Hexachlorocyclotriphosphazene was reacted by nucleophilic substitution with nucleophilic sodium phenate and 4,4＂-diaminodiphenyl ether to synthetize 2,4- his [4＇-（4＂＇-aminophenoxy） phenylamino] tetraphenoxyl cyclotriphosphazene （AOPPZ）. Then AOPPZ and paraphthaloyl chloride were polymerized to a novel poly （cyclotriphosphazene-aryl amide） （POPA）. The chemical structures of AOPPZ and POPA were characterized by Fourier transform infrared and nuclear magnetic resonance. Results show that the existences of phenoxy substituent structures were proved on AOPPZ and POPA, and six C1 atoms on cyclotriphosphazene ring were replaced completely. Polyamide structure was also founded in the main chain of POPA. The initial decomposition temperature of AOPPZ was round 200℃, and its solid residual amount was 56.4wt %at 600 ℃, but POPA initial decomposition temperature was 220 ℃, the maximum degradation rate at 355 ℃, and 55.6wt% of POPA remained at 600 ℃.

关 键 词：六氯环三磷腈 聚环三膦腈-芳酰胺 合成 

分 类 号：TB324[一般工业技术—材料科学与工程] TB35