无镍枪色锡-钴合金电镀工艺  

Technology for Nickel-Free Gun-Color Tin-Cobalt Alloy Electroplating on Copper

作　　者：郭远凯[1] 唐春保[1] 赖俐超[1] 

机构地区：[1]嘉应学院化学与环境学院,广东梅州514015

出　　处：《材料保护》2012年第10期39-41,1,共3页Materials Protection

摘　　要：为了节约镍资源及降低传统枪色电镀产品的毒性,开发了一种无镍枪色锡-钴合金电镀工艺:采用焦磷酸盐体系并添加光亮剂直接在铜片表面进行锡-钴合金电镀。探讨了镀液组成、温度、pH值及电流密度对镀层外观、镀液稳定性的影响,确定了其最佳工艺参数:250.0 g/L焦磷酸钾,20.0 g/L硫酸亚锡,15.0 g/L硫酸钴,0.6 g/L光亮剂1,2.0 g/L光亮剂2,3 mL/L 25%氨水,温度45℃,pH值8.5,电流密度0.5 A/dm2,施镀时间3 min。该工艺所得镀层颜色呈枪色,均匀致密,附着力好,且镀液稳定。To conserve nickel resources and reduce the toxicity of traditional gun-color plating products,brighteners were introduced into pyrophosphate system for Sn-Co alloy electroplating on copper sheets and a process for nickel-free gun color Sn-Co alloy electroplating on copper was established.The effects of bath composition,temperature,pH value and current density on coating appearance and bath stability were investigated;and the optimal electroplating parameters were established.Results show that the plating bath has an optimal composition of 15.0 g/L stannous sulfate,20.0 g/L cobalt sulphate,0.6 g/L brightener 1,2.0 g/L brightener 2,and 3 mL/L 25% ammonia;and the optimal electroplating parameters are suggested as bath temperature of 45 ℃ and bath pH value of 8.5 as well as current density of 0.5 A/dm2 and plating time of 3 min.The gun-color Sn-Co alloy coating prepared under the optimal electroplating parameters is compact and uniform and well adhered to copper substrate,while the plating bath with the optimal composition has good stability.

关 键 词：锡-钴合金电镀 焦磷酸盐 硫酸亚锡 硫酸钴 枪色 工艺参数 

分 类 号：TQ153.2[化学工程—电化学工业]