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作 者:罗永乐[1] 文秀芳[1] 皮丕辉[1] 蔡智奇[1] 林炜创[1] 徐守萍[1] 程江[1]
机构地区:[1]华南理工大学化学与化工学院,广东广州510640
出 处:《电镀与涂饰》2012年第10期53-56,共4页Electroplating & Finishing
摘 要:采用程序升温法研究了对氨基苯甲酸改性双酚A酚醛环氧树脂乳液/聚酰胺8536体系的固化行为,利用非等温DSC法考察不同升温速率的固化反应峰值温度,通过Kissinger和Crane方程得到该体系的固化反应动力学参数,并通过外推法确定了理论固化工艺温度为:凝胶温度372.7K,固化温度398.6K,后处理温度405.1K。在此基础上,将水性酚醛环氧乳液和聚酰胺固化剂8536固化体系的固化条件确定为140°C、0.5h。由此得到的涂膜平整光滑,硬度达到6H,附着力与柔韧性好,具有优良的耐水性和耐化学介质性。The curing behavior of p-aminobenzoic acid modified bisphenol A phenolic epoxy resin emulsion with polyamide 8536 as curing agent was studied by programmed heating method. The peak temperatures during the curing reaction at different heating rates were examined by non-isothermal DSC (differential scanning calorimetry) method. The kinetic parameters of the curing reaction were obtained by Kissinger and Crane equations. The theoretical curing temperatures were determined by extrapolation method as follows: gelling temperature 372.7 K, curing temperature 398.6 K, and post-treatment temperature 405.1 K. On this basis the curing conditions of the system comprising water-based novolac epoxy emulsion and polyamide curing agent 8536 were determined: temperature 140 ℃ and time 0.5 h. The coatings obtained under these conditions are uniform and smooth with a hardness up to 6H, having good adhesion and flexibility as well as high resistance to water and chemical media.
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