复合型微通道热沉设计与制作技术研究  

Research on the Design and Fabrication Technology of the Compound Micro-Channel Heat Sink

作　　者：王媛媛[1] 孙娜[2] 常慧曾[1] 王伟[1] 任浩[1] 徐会武[1] 安振峰[1] 

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050002 [2]国家知识产权局专利局专利审查协作北京中心,北京100000

出　　处：《微纳电子技术》2012年第10期688-692,共5页Micronanoelectronic Technology

摘　　要：从大功率半导体激光器可靠性封装和应用考虑,利用商用有限元软件Abaqus与CFdesign对微通道热沉材料、结构进行优化设计,结合相应的制造工艺流程制备实用化复合型微通道热沉。微通道热沉尺寸为27 mm×10.8 mm×1.5 mm,并利用大功率半导体激光阵列器件对所制备热沉进行散热能力、封装产生的"微笑效应"进行了测试,复合微通道热沉热阻约0.3 K/W,"微笑"值远小于无氧铜微通道封装线阵列,可以控制在1μm以下。复合型微通道热沉能满足半导体激光阵列器件高功率集成输出的散热需求与硬焊料封装的可靠性要求。A practical compound micro-channel heat sink was produced by considering the reliabi-lity package and application conditions of high-power semiconductor lasers,and combining with the corresponding manufacturing process.The materials and structures design were optimized using the commercial finite element software Abaqus and CFdesign.The microchannel heat sink size is 27 mm×10.8 mm×1.5 mm.The cooling capacity and ＂smile effect＂ produced by the package was tested with the high power semiconductor laser array device.The compound micro-channel heat sink package thermal resistance is about 0.3 K/W.The value of the ＂smile effect＂ is far less than that of the oxygen-free copper micro-channel packaging array,and it could be kept less than 1 μm.The compound micro-channel heat sink can meet the cooling requirements of the high power density integrated output of semiconductor laser arrays and reliability requirements of the hard solder package.

关 键 词：激光器 复合型微通道热沉 热匹配 热阻 有限元分析 

分 类 号：TN365[电子电信—物理电子学] TN305.94