微波裸芯片临时封装夹具微波信号传输的优化  

Optimization on Microwave Transmission of Temporary Package for Microwave Bare Die

作　　者：徐丽[1,2] 黄云[2] 周斌[2] 

机构地区：[1]华南理工大学,广东广州510640 [2]工业和信息化部电子第五研究所,广东广州510610

出　　处：《电子产品可靠性与环境试验》2012年第5期60-65,共6页Electronic Product Reliability and Environmental Testing

摘　　要：微波传输线是微波系统的重要组成部分。随着微波系统向高频化方向发展．传输线中的不连续带来的信号完整性问题越发凸显并受到广泛的关注。针对微波裸芯片临时封装夹具系统。设计了适合2～6GHz频段的微波传输线，通过三维电磁仿真软件（HFSS）对传输线的传输性能进行了仿真验证；并由先进设计系统（ADS）软件提取了临时封装夹具中微波传输路径的等效RLC电路参数模型。最终得到的传输结构S11小于-15dB，S21大于-1dB，符合良好匹配传输线的要求。Microwave transmission line is an important part of microwave system. As the microwave system developed towards high frequency, the signal integrity problem brought by discontinuity of the signal transmission line became more obvious and received more attention. Aiming at constituting a temporary package system for microwave bare die, a micro-strip line for 2GHz -6GHz was designed, and the RLC equivalent circuit of the microwave transmission path in the temporary package carrier was obtained by ADS after the microwave transmission performance of the micro-strip line was validated through HFSS simulation. A transmission structure with Sjl lower than -15dB and S21 higher than -ldB was finally obtained, which meets the demands of good matching transmission line.

关 键 词：临时封装夹具 微波信号传输线 信号完整性 三维电磁仿真软件 

分 类 号：TN405[电子电信—微电子学与固体电子学]