金刚石微粒表面化学镀镍  

Electroless Nickel Plating on Diamond Particles

作　　者：任春春[1] 林国兴[1] 梅天庆[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,江苏南京211106

出　　处：《电镀与精饰》2012年第10期35-38,共4页Plating & Finishing

摘　　要：以金刚石微粒为基体在超声搅拌的情况下,经除油、粗化、敏化、活化及还原等前处理过程后,进行化学镀镍。通过控制溶液pH,温度,反应时间和装载量,在金刚石微粉上面获得了一层覆盖完整、均匀致密的镍层。采用场发射扫描电子显微镜对不同工艺条件下制备的镍镀层进行测试分析,获知了不同实验条件下对镀镍层的形成的影响,并得出较为合适的化学镀镍工艺参数。Under the ultrasonic stirring condition, Ni-P alloy film on diamond particles was prepared after degreasing, roughening, sensitization, activation and reduction pretreatment process. A uniform and dense Ni layer was deposited on diamond paticles by controlling the pH value, temperature, reaction time and loading capacity of solution. The surface morphology and composition of Ni-P coating under different con- ditions were observed and determined by field emission scanning electron microscopy. The influence of plating parameters on the properties of Ni-P coating was investigated, and the optimum experimental con- ditions were obtained.

关 键 词：金刚石微粒 化学镀镍 表面形貌 NI-P合金镀层 装载量 

分 类 号：TQ630.4[化学工程—精细化工]