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作 者:Karnthidapom Wattanakul Sittisak Satasit
出 处:《Journal of Chemistry and Chemical Engineering》2012年第9期769-773,共5页化学与化工(英文版)
摘 要:A new thermally conductive thermoset composite has been developed. A hybrid organic-inorganic material composed of an epoxy resin crosslinked with a flexible diamine hardener, and a BN, was prepared by incorporating epoxy structure units covalently into a BN via the sol-gel approach. The precursor was obtained by the reaction of DGEBA (diglycidyl ether of bisphenol A) with TEOS (tetraethyl orthosilicate). The precursor was then hydrolyzed and co-condensated with tetraethyl orthosilicate which is covalently bond with the hydroxyl groups on the BN surface at room temperature to yield epoxy-BN hybrid sol-gel material. FTIR spectroscopy confirmed the formation of organic and inorganic network. The thermal conductivity as measured by thermal conductive analyzer showed an increase up to 0.4048 W/m.K, for a mixture containing 0.4 wt% of BN fillers in the epoxy matrix. Moreover, the optimum conditions for surface modification of BN particle were also investigated.
关 键 词:BN filled-epoxy composite particle orientation chemical modification of epoxy sol-gel method inorganic-organichybrid.
分 类 号:TQ325[化学工程—合成树脂塑料工业] TQ174.756
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