电路板的高加速应力筛选仿真设计技术研究  

Research of Circuit Board Highly Accelerated Stress Screening Simulation Design

作　　者：彭丽 

机构地区：[1]空军军械通用装备军事代表局,北京100166

出　　处：《装备环境工程》2012年第5期112-117,共6页Equipment Environmental Engineering

摘　　要：针对某型电路板高加速应力筛选剖面设计中耗费大量人力物力的实际情况,结合目前计算机辅助及仿真技术所具有的成本低、周期短、精度高等特点,将高加速应力筛选及计算机仿真技术融合,提出了运用计算机仿真手段来研究产品的高加速应力筛选剖面的方法及基本思路。对剩余有效寿命的预计、缺陷影响以及应力影响等方面进行了研究分析。从而在高加速应力筛选剖面设计信息量的扩充、成本的节省、周期的缩短等方面起到了一定的促进作用。The existing large resource consuming problem of highly accelerated stress screening was analyzed.Method and consideration of using computer simulation for studying highly accelerated stress screening profile was put forward by integrating the technologies of highly accelerated stress screening and computer simulation and making use of the low cost,short cycle and high-precision characteristics of simulation technique.The remaining useful life,defect influence,and stress influence were studied and analyzed.The method has promotion function in extending information,saving cost,and shortening time of highly accelerated stress screening profile design.

关 键 词：高加速应力筛选 计算机仿真 电路板 

分 类 号：TB114.37[理学—概率论与数理统计]