基于LTCC技术的表贴式封装SAWF  

SAWF with SMD Packaging Based on LTCC

作　　者：杨建华[1] 史荣昌[1] 侯清健[1] 

机构地区：[1]南京电子技术研究所,南京210039

出　　处：《现代雷达》2012年第10期70-73,共4页Modern Radar

摘　　要：提出一种基于低温共烧结陶瓷(LTCC)技术的封装形式,将声表面波滤波器(SAWF)做成表面贴装器件(SMD)。该封装结构可实现SAWF基片表面上方2个换能器间的隔离,提高SAWF的阻带抑制,其器件适合于高密度组装,进而可演变成SAWF集成在电路模块的LTCC多层电路板上,即直接将SAWF的裸基片掩埋在LTCC多层电路板内,实现器件—电路一体化。A package form based on low temperature co-fired ceramic （ LTCC ） is proposed in this paper, it is successful that the surface acoustic wave filter （SAWF） is made as surface mounted devices （SMD） . The SAWF substrate surface segregation be- tween two transducers can be realized by the packaging structure for improving SAWF stopband rejection. The advantages of the de- vice are suitable for high density assembly, and then SAWF is integrated into the LTCC multilayer circuit board of circuit module, the SAWF bare substrate is buried directly in LTCC muhilayer circuit board for realizing device-circuit integration.

关 键 词：声表面波滤波器 低温共烧结陶瓷 表面贴装器件 阻带抑制 高密度组装 一体化 

分 类 号：TN713[电子电信—电路与系统]