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作 者:寿奉粮[1] 赵芳霞[1] 杨博[1] 张振忠[1]
机构地区:[1]南京工业大学材料科学与工程学院,江苏南京210009
出 处:《电子元件与材料》2012年第11期71-74,共4页Electronic Components And Materials
基 金:江苏高校优势学科建设工程资助项目;广西科技成果转化与推广计划资助项目(No.1298009-15)
摘 要:采用高频超声脉冲电解法从电镀铜废液中回收制备枝晶状的铜粉,并在铜粉表面进行化学镀银以制备电磁屏蔽用银包铜粉,采用SEM、EDS、XRD、TEM等对其进行形貌和组分分析,研究了银包铜粉复合涂层的导电性能和电磁屏蔽性能。结果表明,经过表面化学镀银可以有效地避免铜粉的氧化;涂层的电磁屏蔽性能与银包铜粉的添加量紧密相关,当涂层中银包铜粉质量分数为60%时,其电磁屏蔽效率高达52 dB。Dendrite structural copper powders were prepared fi'om copper-containing electroplating effluents by pulsed sonoelectrochemical method and electroless silver plating on copper powders to prepare silver coating copper powders for electromagnetic shielding. The morphology and composition of the copper powders and silver covered copper powders were characterized by SEM, EDS, XRD, TEM, etc. The composite coating conductivity and electromagnetic shielding properties were studied. Results show that through the copper powders surfaces of the electroless silver plating can effectively avoid the oxidation, electromagnetic shielding properties of composite coating are closely related to the amount of the added powders. When the mass fraction of silver coating copper powders is 60% in the coating, the shielding effectiveness is about 52 dB.
关 键 词:电镀铜废液:超声脉冲电解法 电磁屏蔽性能 银包铜粉 化学镀银
分 类 号:TB34[一般工业技术—材料科学与工程]
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