纳米颗粒弥散强化铜基复合材料的显微组织与性能  

Microstructure and Properties of Dispersion Strengthened Copper Matrix Composites by Nanoparticles

作　　者：付云龙[1] 龚红英[1] 宋克星[2] 

机构地区：[1]上海工程技术大学材料工程学院,上海201620 [2]河南科技大学材料科学与工程学院,洛阳471003

出　　处：《上海工程技术大学学报》2012年第3期259-262,共4页Journal of Shanghai University of Engineering Science

基　　金：国家自然科学基金资助项目(51075122U1034002);河南省科技创新杰出青年基金资助项目(094100510005);洛阳市科技攻关资助项目(0903041A);上海工程技术大学研究生科研创新资助项目(A-2503-12-01K169)

摘　　要：采用粉末冶金的方法,以Al2O3,SiO2,SiC和MgO等纳米颗粒为增强相,制备出4种不同颗粒的纳米复合材料,研究了各增强相对复合材料显微组织与性能的影响.结果表明:在相同的质量分数(w)和制备工艺下,不同弥散相颗粒的弥散强化铜合金显微组织不同,铜基体上大体均匀地分布着细小的弥散相颗粒,但部分区域仍存在偏聚现象.4种复合材料的电导率相近,抗拉强度方面Cu/Al2O3与Cu/SiO2的性能要略好于Cu/SiC与Cu/MgO.Reinforced between different particle types with Al2O3, SiO2, SiC and MgO nanoparticles, four nanocomposites were prepared by powder metallurgy method. Effects of strengthening phases on the microstructure and properties of the composites were investigated. The result shows that preparing in the same way and with the same mass fraction,microstructures of dispersion strengthened copper alloys with different dispersion particles are different, minute dispersion particulates are revealed uniform distribution on the surface of copper matrix, and phase segregation is investigated in partial regions. Electrical conductivities of four composites are similar and tensile strength properties of Cu/Al2O3 and Cu/SiO2 are better than Cu/SiC and Cu/MgO.

关 键 词：弥散强化 微观组织 抗拉强度 电导率 

分 类 号：TB333[一般工业技术—材料科学与工程]