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作 者:沈以赴[1] 李永灿[1] 陈成[1] 冯晓梅[1]
机构地区:[1]南京航空航天大学材料科学与技术学院,南京210016
出 处:《南京航空航天大学学报》2012年第5期762-768,共7页Journal of Nanjing University of Aeronautics & Astronautics
基 金:国家自然科学基金(51075205)资助项目
摘 要:采用机械合金化方法于Al2O3陶瓷表面制得Cu涂层,研究了不同球磨时间的工艺条件下,陶瓷表面金属涂层的微观组织形貌,并对机械合金化过程中陶瓷表面金属化的过程作了相关探讨。实验结果表明,在磨球撞击和摩擦的反复作用下,铜粉首先附着在陶瓷基体表面并填充表面的凹坑,然后在进一步球磨过程中冷焊到基体表面,最终在陶瓷表面形成Cu涂层;涂层与基体之间基本无扩散,结合机制主要为机械结合;适当延长球磨时间,有利于涂层厚度、致密度的增加。划痕法测试表明,涂层与陶瓷基体结合较为紧密且并无起翘剥落。Copper coating is obtained on the alumina ceramic surface through mechamcal alloying. I ne microstructures of the metal coating with different milling time are studied and the formation process of surface metallization is discussed. It is found that based on ball-to-substrate collisions and frictions, Cu particles firstly adher to the surface of alumina ceramic and fill the pits on the surface, and through a relatively long time process of cold welding, Cu particles gradually cover the surface of ceramic and form coating layer. The fact that almost no diffusion caused between metal coating layer and the ceramic substrate is confirmed in this study, and the coatings and substrate are mechanically bonded. It is revealed that a proper increasing of milling time can improve the thickness and densification level of the deposited coatings. Scratch test confirms the relatively good bonding between coatings and the ceramic substrate, and almost no coatings are peeled off after scratch test.
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