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作 者:吴永智[1] 李海刚[1] 毛建英[1] 毕建勋[1] 梁德彬[1]
出 处:《宇航材料工艺》2012年第5期64-68,共5页Aerospace Materials & Technology
摘 要:采用AgCuTi+10vol%~30vol%SiC对C/SiC与TC4进行钎焊,后对钎焊接头进行室温~600℃热震试验。使用扫描电镜观察了不同钎焊工艺下,钎焊接头的界面微观组织和热震裂纹的产生情况。结果表明:随着连接材料中SiC粉末含量的增加,接头残余应力降低;采用较大间隙值钎焊工艺,当中间层内SiC颗粒含量较高时(20vol%~30vol%),经过30次热震试验后,钎焊试样未发现热震裂纹。C/SiC composites and TC4 titanium alloy were joined by brazing technique, using AgCuTi+10vol% to 30vol% SiC composite filler metals and the thermal shock behavior of the joints were investigated between 600℃ and room temperature. Interface microstructures and fracture cracks were investigated by scanning electron microscopy ( with EDS energy spectrum). The results showed the thermal stress of the joints reduces evidently, with the increase of the amount of SiC particle. In the brazing joihts, thermal shock cracks can be found in the SiC ceramics near bond- ing layer or in the fillet. It seems that wide-gap brazing samples have better thermal shock resistance, and no cracks were obscured for filler metals containing 20vol% to 30vol% SiC particle, after 30 times thermal shock testing.
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