导热高分子材料的研究与应用  

RESEARCH AND APPLICATIONS OF THERMAL CONDUCTING POLYMER

作　　者：储九荣[1] 张晓辉[1] 徐传骧[1] 

机构地区：[1]西安交通大学电气工程学院电气绝缘研究所,陕西西安710049

出　　处：《高分子材料科学与工程》2000年第4期17-21,共5页Polymer Materials Science & Engineering

摘　　要：介绍了金属材料、非金属材料、高分子材料的导热机理 ,以及导热填料搀杂高分子材料的导热理论模型。综述了各种高导热填料的研究进展和它们在导热高分子材料中的应用情况。最后提出了导热高分子材料的研究方向。Thermal conductivity of polymers is general worse than metals and some metallic oxides or graphite. Commonly thermal conducting polymeric materials with good comprehensive properties is attained by mixing fillers, which have high thermal conductivity. They have well application prospects in the fields of power, electronics industry and so on. Thermal conducting mechanism of metals, non metals and polymers, and theoretical models of thermal conducting polymeric materials mixed with high thermal conducting fillers were introduced. Also research developments on high thermal conducting fillers and their applications in thermal conducting polymeric materials were summarized. At last, the research directions of thermal conducting polymeric materials were raised.

关 键 词：导热高分子材料 导热机理 导热填料 

分 类 号：O631.22[理学—高分子化学] TQ317.3[理学—化学]