覆铜箔板热导率对导体温升影响的研究  

The research of the influence of CCL thermal conductivity to the conductor temperature rise

作　　者：曾耀德 王换宝 张凯 

机构地区：[1]陕西生益科技有限公司,陕西咸阳712000

出　　处：《印制电路信息》2012年第11期21-23,共3页Printed Circuit Information

摘　　要：对比测试了热导率不同的覆铜箔板在相同电流与导体横截面积条件下的导体温升,分析了覆铜箔板热导率对导体温升的影响,使用高热导率的CEM-3覆铜箔板可以减少导体的温升,提高电源基板的安全可靠性。This paper tests for conductor temperature rise under the same current and cross-sectional area using different type copper clad laminate where there are different thermal conductivity.It analyzed the coefficient effects of thermal conductivity to the conductor temperature rise influence.Using high thermal conductivity CEM-3,we can reduce the conductor temperature rise and will enhance the reliability of the power board.

关 键 词：热导率 导体温升 载流能力 CEM-3 

分 类 号：TN41[电子电信—微电子学与固体电子学]