Effect of indium addition on the microstructural formation and soldered interfaces of Sn-2.5Bi-1Zn-0.3Ag lead-free solder  

作　　者：Ming-jie Dong Zhi-ming Gao Yong-chang Liu Xun Wang Li-ming Yu 

机构地区：[1]School of Materials Science&Engineering,Tianjin Key Laboratory of Advanced Jointing Technology,Tianjin University,Tianjin 300072,China

出　　处：《International Journal of Minerals,Metallurgy and Materials》2012年第11期1029-1035,共7页矿物冶金与材料学报（英文版）

基　　金：the National Natural Science Foundation of China(No.51077099);Shang hai Baosteel Group Co.(No.50834011)

摘　　要：The microstructural formation and properties of Sn-2.5Bi-xln-lZn-0.3Ag （in wt%） alloys and the evolution of soldered interfaces on a Cu substrate were investigated. Apart from the relatively low melting point （about 195C）, which is close to that of conventional eutectic Sn-Pb solder, the investigated solder presents superior wettability, solderability, and ductility. The refined equiaxial grains enhance the me- chanical properties, and the embedded bulk intermetallic compounds （IMCs） （Cu6Sn5 and CusZns） and granular Bi particles improve the joint reliability. The addition of In reduces the solubility of Zn in the 13-Sn matrix and strongly influences the separation and growth behaviors of the IMCs. The soldered interface of Sn-2.5Bi-xln-lZn-0.3Ag/Cu consists of Cu-Zn and Cu-Sn IMC layers.The microstructural formation and properties of Sn-2.5Bi-xln-lZn-0.3Ag （in wt%） alloys and the evolution of soldered interfaces on a Cu substrate were investigated. Apart from the relatively low melting point （about 195C）, which is close to that of conventional eutectic Sn-Pb solder, the investigated solder presents superior wettability, solderability, and ductility. The refined equiaxial grains enhance the me- chanical properties, and the embedded bulk intermetallic compounds （IMCs） （Cu6Sn5 and CusZns） and granular Bi particles improve the joint reliability. The addition of In reduces the solubility of Zn in the 13-Sn matrix and strongly influences the separation and growth behaviors of the IMCs. The soldered interface of Sn-2.5Bi-xln-lZn-0.3Ag/Cu consists of Cu-Zn and Cu-Sn IMC layers.

关 键 词：soldering alloys INDIUM microstrucmre INTERFACES melting point INTERMETALLICS 

分 类 号：O614[理学—无机化学] TN405[理学—化学]