空间大规模CMOS面阵焦平面拼接技术  

Mosaic of spatial large scale CMOS focal plane array

作　　者：雍朝良[1] 林剑春[1] 赵明[1] 陈凡胜[1] 

机构地区：[1]中国科学院上海技术物理研究所,上海200083

出　　处：《红外与激光工程》2012年第10期2561-2566,共6页Infrared and Laser Engineering

基　　金：国家自然科学基金(61071032);国家重点实验室开放基金(KFJJ200917)

摘　　要：为了提高空间遥感器的时间分辨率,采用更大规模的红外焦平面阵列和可见焦平面阵列是未来高时间分辨率空间遥感的发展趋势。目前,由于大规模阵列探测器受到CMOS工艺的限制,不能满足空间高时间分辨率发展的要求。为了满足大规模焦平面遥感应用的要求,提出了一种大规模阵列焦平面机械的拼接方法。该方法采用精密压电陶瓷电机,完成探测器焦平面的微米量级位置调整,并通过激光测距仪测量以及计算机平面拟合来确定探测器焦平面的空间位置,进而实现了大规模非连续CMOS焦平面阵列的机械式拼接。In order to improve the time resolution of space remote sensor, using more large-scale infrared focal plane array and visible focal plane array are the future trend of the high time resolution space remote sensing. By now, the scale of the massive array detector is limited by the CMOS technology, thus it is unable to meet the requirements of the development of the space high time resolution detect. In order to meet the needs of large focal plane remote sensing application a novel method of assembling the large scale FPA （Focal Plane Array）was presnted. The precision piezoelectric ceramic motor was used to complete the position adjustment of focal plane of the detector in micrometer. Laser range finder measurement and computer plane fitting were used to determine the spatial position of the detector focal plane, thereby large-scale non-continuous mechanical splicing of the CMOS focal plane array was achieved.

关 键 词：探测器拼接 焦平面 激光测距 

分 类 号：TM133[电气工程—电工理论与新技术]