高强高导铜合金强化技术研究进展  

Recent Development in Strengthening Techniques of High Strength and High Conductive Copper Alloys

作　　者：张蓓[1] 张治国[1] 李卫[1] 

机构地区：[1]暨南大学材料科学与工程系,广州510632

出　　处：《材料导报》2012年第21期92-95,共4页Materials Reports

基　　金：NSFC-广东联合基金重点项目(U1034002)

摘　　要：铜及铜合金在众多领域得到了广泛应用,然而随着现代工业技术的发展,传统强化方法得到的高强高导铜合金已不能完全满足对其综合性能的需求。从基体强化和表面改性两个方面综述了国内外高强高导铜合金强化技术的最新研究进展。主要介绍了喷射成型法、脉冲电沉积法等新型铜合金成型工艺技术和激光束表面熔覆、喷涂涂覆、离子注入技术及粉末包埋渗等表面改性技术,并展望了铜合金表面改性技术的发展趋势。Copper and its alloys are extensively applied in various industries. However, with the development of modern industry, the copper alloys with high-strength and high-conductivity prepared by traditional strengthening technologies have lost the ability to fulfill the combination property requirement. The recent progress on enhancing techniques of high-strength and high-conductive copper alloys is reviewed, with the emphasis on the substrate strengthening and surface strengthening technologies. A various technologies, such as spray deposition, pulsed elec- trodeposition of new copper alloy forming technology and the laser cladding, surface spaying, ion implantation and pack cementation of surface modification technology, are introduced, and the trends of surface modification technolo- gies is commented.

关 键 词：高强高导铜合金 基体强化 表面改性 

分 类 号：TS252.2[轻工技术与工程—农产品加工及贮藏工程]