Cu-Ni-P合金的电沉积及镀层性能  

Preparation of Electrodeposited Cu-Ni-P Alloy Coating By Induced Codeposition

作　　者：白新波[1] 王为[1] 

机构地区：[1]天津大学应用化学系,天津300072

出　　处：《材料保护》2012年第11期10-12,3,共3页Materials Protection

基　　金：科技部国际合作项目(2009DFA62700)资助

摘　　要：目前,少有Cu-Ni-P合金电沉积的研究报道,为此,采用电沉积法制备了Cu-Ni-P镀层,通过循环伏安法考察了铜在Cu-Ni-P镀液中的电化学行为,在此基础上,采用恒电位电沉积法在柠檬酸体系中制备了Cu-Ni-P三元合金镀层,并对镀层的形貌和硬度进行了表征。结果表明:不能单独与铜共沉积的非金属元素P,在一定的工艺条件下,通过在有铜离子的溶液中与镍的诱导共沉积,可以与铜形成Cu-Ni-P合金镀层;Cu-Ni-P合金镀层形貌良好,硬度比Cu镀层有显著提高。The electrochemical behavior of Cu in Cu-Ni-P electroplating bath was investigated by cyclic voltammetry.Then Cu-Ni-P ternary alloy coating was prepared by potentiostatic electrodeposition in a citric acid-type plating bath.The morphology of as-obtained alloy coating was observed,and its hardness was measured.Results show that,although non-metallic element P can not be directly co-deposited with copper,it can be induced to co-deposit with Ni in a solution containing Cu2+,Ni2+ and H2PO-2 ions yielding Cu-Ni-P ternary alloy coating.As-obtained Cu-Ni-P alloy coating has good surface morphology,and its hardness is much higher than that of electrodeposited Cu coating.

关 键 词：Cu—Ni—P合金电沉积 恒电位电沉积 诱导共沉积 镀层硬度 

分 类 号：TQ153.2[化学工程—电化学工业]