非晶纳米晶Ni-P合金的流动镀工艺  

Flow Plating Process of Amorphous-nanocrystalline Composite Structured Ni-P Alloy

作　　者：雷扬[1] 袁学韬[1] 孙冬柏[2] 华志强[1] 王磊[1] 李弢[1] 

机构地区：[1]北京有色金属研究总院,北京100088 [2]北京科技大学,北京100083

出　　处：《腐蚀与防护》2012年第11期1014-1018,共5页Corrosion & Protection

摘　　要：非晶纳米晶Ni-P合金由于其良好的综合性能得到广泛应用,流动镀技术由于可大幅提高沉积速度而受到极大关注。本工作研究了电解液流速、阴极电流密度和阴阳极间距等工艺参数对镀速、Ni-P合金P含量和表面形貌的影响规律,并初步探讨了各工艺参数对电化学沉积过程的影响机理。Amorphous-nanocrystalline composite structured Ni-P alloys were widely used in many fields due to their good combination properties. Flow plating receives more attentions as it can improve the deposition rate. In this woric, the influence of electrode distance, current density of cathode and flow rate of electrolyte on the deposition rate, phosphorus content and morphology of the Ni-P deposits was investigated by changing the different technology conditions. The effect mechanism of different technology factors on the course of electrodeposition was also discussed. ：

关 键 词：流动场 Ni—P合金 磷含量 沉积速度 

分 类 号：TG174.44[金属学及工艺—金属表面处理]