Influence of electron-beam superposition welding on intermetallic layer of Cu/Ti joint  

Cu/Ti电子束叠加焊接对金属间化合物层的影响(英文)

作　　者：陈国庆[1] 张秉刚[1] 刘伟[1] 冯吉才[1] 

机构地区：[1]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001

出　　处：《Transactions of Nonferrous Metals Society of China》2012年第10期2416-2420,共5页中国有色金属学报（英文版）

基　　金：Project (2010CB731704) supported by the National Basic Research Program of China

摘　　要：QCr0.8 was electron-beam welded to TC4 and the effect of the intermetallic layer （IMC-layer） on the mechanical properties of the joint was investigated. The IMC-layers are joint weaknesses at the Cu fusion line in centered welding and at the Ti fusion line when the beam is deviated towards Cu. A new method referred to as electron-beam superposition welding was presented, and the optimal welding sequence was considered. The IMC-layer produced by centered welding was fragmented and remelted during Cu-side non-centered welding, giving a finely structured compound layer and improved mechanical properties of the joint. The tensile strength of joint is 276.0 MPa, 76.7% that of the base metal.对QCr0.8/TC4进行电子束焊接,研究焊缝中金属间化合物层(即IMC-layer)对接头力学性能的不利影响,提出利用电子束二次叠加焊接方式来改善接头性能的思路。结果表明,对中焊时在铜侧熔合线处形成的金属间化合物层,偏铜侧焊接时在钛侧熔合线处形成的金属间化合物层,是接头中的薄弱环节。利用电子束叠加焊接方式,须合理设计焊接顺序。先进行对中焊,再利用偏铜侧焊接,可将第一道焊缝形成的金属间化合物层破碎重熔,形成组织较好的化合物层,改善接头的力学性能。接头的抗拉强度为276.0MPa,达到了母材强度的76.7%。

关 键 词：Cu alloy Ti alloy electron beam superposition welding IMC-layer 

分 类 号：TG456.3[金属学及工艺—焊接]