精密电子元器件用抗冲击灌封材料的施工工艺研究  

Study on operation technologies of anti-impact encapsulating materials used for precision electron parts and components

作　　者：张凯[1] 范敬辉[1] 马艳[1] 吴菊英[1] 

机构地区：[1]中国工程物理研究院总体工程研究所,四川绵阳621900

出　　处：《现代电子技术》2012年第22期192-194,共3页Modern Electronics Technique

基　　金：中国工程物理研究院科学技术发展基金资助项目(2009A0302018)

摘　　要：为了保证电子元器件在高过载环境下保持有效性和可靠性,在研制性能优异的抗冲击环氧树脂灌封材料的基础上,可行有效的施工工艺是保证灌封产品质量的重要环节。采用自制带液晶基团的环氧树脂对环氧树脂E-51进行增韧改性,分析灌封材料施工工艺中灌封工艺和固化工艺的影响因素,确定了不同结构灌封体的灌封工艺,以及确定固化剂用量为30%,环境温度为25℃的固化工艺条件。按照施工工艺完成的电子产品灌封体,合格率>95%。In order to keep validity and reliability of electron parts and components under high overload environment, an effective operation technology to ensure the quality of encapsulated products was researched on the basis of preparation of anti- impact epoxy resin encapsulating materials with excellent performance. In this research, the epoxy resin with liquid crystal perssad was employed to strengthen the tenacious performance of epoxy resin E-51, the influence of encapsulating and curing processes of encapsulating materials on the product quality was analyzed, the encapsulating process for different products was confirmed. The the amount of curing agent in encapsulating materials was 30%, and the curing temperature was 25 ℃. Ac- cording to these operation technologies, the product pass rate is more than 95%.

关 键 词：电子元器件 环氧树脂 抗冲击灌封材料 施工工艺 

分 类 号：TN919-34[电子电信—通信与信息系统]