化学镀预处理工艺的研究现状及展望  

Study on Reality and Prospect of Pretreatment Process of Electroless Copper Plating

作　　者：由劲博[1] 龙晋明[1] 张秀[1] 

机构地区：[1]昆明理工大学材料科学与工程学院,云南昆明650093

出　　处：《热加工工艺》2012年第22期203-206,共4页Hot Working Technology

摘　　要：在化学镀技术中,预处理工艺直接影响了镀层的质量及性能。本文着重介绍了化学镀预处理工艺的发展概况和研究进展,综述了几年来国内外在化学镀预处理方面所取得的研究成果,并对今后预处理工艺的发展方向进行了展望。The pretreatrnent process has a direct impact on the coating quality and performance in the electroless plating technique. The overview of the development and research progress of electroless plating pretreatment technology were described. Research achievements of the past few years in China and abroad was discussed. And pretreatment technology in the future development direction was forecasted.

关 键 词：化学镀 预处理 非金属 

分 类 号：TG174[金属学及工艺—金属表面处理]