氰酸酯/环氧树脂/苯基三硅羟基倍半硅氧烷复合材料研究  

Study on cyanate ester/epoxy resin/trisilanolphenyl polyhedral oligomeric silsesquioxane(POSS)composites

作　　者：赵春宝[1,2] 张楠楠[3] 

机构地区：[1]南京信息职业技术学院微电子学院,南京210046 [2]南京理工大学软化学与功能材料教育部重点实验室,南京210094 [3]中国航天工程咨询中心,北京100048

出　　处：《化工新型材料》2012年第11期40-42,共3页New Chemical Materials

基　　金：江苏省博士后科研资助计划(1001015B);江苏省自然科学基金项目(BK2011838);江苏省"青蓝工程"资助

摘　　要：将苯基三硅羟基倍半硅氧烷(T7)引入氰酸酯树脂(CE)和环氧树脂(EP)复合体系,制备了一系列CE/EP/T7复合材料。采用傅里叶红外光谱(FT-IR)、扫描电镜(SEM)、动态力学热分析(DMA)及热重分析(TGA)对复合材料的形态与性能进行了表征。结果表明,T7能均匀分散于树脂基体中,并参与了复合体系的固化反应;T7的加入有助于提高CE/EP材料的储能模量和玻璃化转变温度;含T7的CE/EP复合材料仍保持了优异的热稳定性,且在高温阶段的热分解残余量随着T7的含量增加而增大,有利于提高氰酸酯基复合材料的阻燃性能。A series of composites were prepared by incorporating trisilanolphenyl polyhedral oligomeric silsesquioxane（T7）into cyanate ester resin（CE）and epoxy resin（EP）composite system.The morphology and properties were characterized using FT-IR,SEM,DMA and TGA.The results showed that the T7 was homogenously dispersed into composite resin and involved in the curing reaction of the CE/EP/T7 composite systems.The addition of T7 was propitious to the enhancement of storage modului（E）and glass transition temperatures（Tg）of CE/EP composites.The CE/EP composites containing T7 also retained excellent thermal stability.The remain contents of CE/EP/T7 composites during high temperature region was increased gradually with increasing T7 concentration,which was favour to improve the flame retardance of CE resin based composites.

关 键 词：氰酸酯树脂 多面体低聚倍半硅氧烷 复合材料 性能 

分 类 号：TB332[一般工业技术—材料科学与工程]