时效对Sn3.0Cu0.15Ni/Cu界面组织的影响  

Aging effect on the interfacial microstructure between Sn3.0Cu0.15 Ni/Cu

作　　者：钟海峰 刘平 顾小龙 

机构地区：[1]浙江亚通焊材有限公司,浙江杭州310030 [2]浙江省钎焊材料与技术重点实验室,浙江杭州310030

出　　处：《电子元件与材料》2012年第12期56-59,共4页Electronic Components And Materials

基　　金：浙江省科技计划资助项目(No.2010F20002);浙江省2010年自然科学基金资助项目(No.Y4100809)

摘　　要：研究了150℃时效0,200,500 h对Sn3.0Cu0.15Ni/Cu界面组织结构的影响。结果表明:界面金属间化合物层由Cu6Sn5层和Cu3Sn层组成,质量分数为0.15%的Ni的加入会使IMC层最初变厚,但在时效过程中,热稳定性强的界面化合物(Cu,Ni)6Sn5的生成,会抑制Cu3Sn化合物层的生长;同时Ni的加入会降低Cu6Sn5颗粒的长大速度,并且随着时效时间的延长,Cu6Sn5颗粒的形貌呈多面体结构。The aging effect on the interracial structure of Sn3.0Cu0.15 Ni/Cu was studied at 150 ℃ for 0, 200, 500 h. Results show that the intermetallic compound （IMC） layer at the interface is composed of layers of both Cu6Sn5 and Cu3Sn, the addition of w（Ni）=0.15% increases the initial IMC layer thickness, but during the aging process, the interface compound （Cu, Ni）6Sn5 which possesses thermal stability, can inhibit the formation of Cu3Sn layers; at the same time the addition of Ni will reduce the growing speed of Cu6Sn5 particles, and as the aging time increases, the morphology of Cu6Sn5 particle becomes polyhedron structures.

关 键 词：Sn3 0Cu0 15Ni焊料 界面组织 金属间化合物 

分 类 号：TN601[电子电信—电路与系统]