SAC105焊锡膏的开发与评价  

Development and Evaluation of SAC105 Solder Paste

作　　者：马鑫 徐金华 王玲 王宏芹 

机构地区：[1]深圳市亿铖达工业有限公司,广东深圳518101 [2]中国电器科学研究院有限公司,广东广州510300

出　　处：《电子工艺技术》2012年第6期326-329,共4页Electronics Process Technology

基　　金：广东省教育部产学研结合项目(项目编号:2011B090400257)

摘　　要：采用低银化焊料合金是无铅化电子组装提高性价比的发展趋势。开发了采用SAC105低银焊料合金的SUPER105系列焊锡膏,抗氧化、表面绝缘电阻、印刷性能、BGA空洞率、焊点推力等测试结果表明,SUPER105焊锡膏完全适用于消费类电子产品组装。For lead-free electronic assembly,the application of solder alloy with lower silver content is the main tendency in order to improve the ratio of performance to price.SUPER 105 solder paste,which is using SAC105 solder alloy,has been developed.Its performance has been evaluated through the tests on anti-oxidation,surface insulation resistance,printing performance,BGA void and solder joint strength.The results indicate that SUPER105 solder paste is fully applicable for consumer electronic assembly.

关 键 词：低银焊锡膏 无铅化 电子组装 

分 类 号：TG425[金属学及工艺—焊接]