TC4/Ag-Cu-Ti/1Cr18Ni9Ti钎焊接头界面组织与结构  

Interfacial microstructure of TC4 titanium alloy/Ag-Cu-Ti/1Cr18Ni9Ti stainless steel brazed joint

作　　者：张汇文[1] 岳鑫[2] 冯吉才[2] 张九海[2] 

机构地区：[1]哈尔滨焊接研究所,黑龙江哈尔滨150080 [2]哈尔滨工业大学,黑龙江哈尔滨150001

出　　处：《机械制造文摘（焊接分册）》2012年第4期35-39,共5页Welding Digest of Machinery Manufacturing

摘　　要：以Ag-Cu-Ti箔状钎料对钛合金TC4和不锈钢1Cr18Ni9Ti进行了真空钎焊。采用扫描电镜、能谱分析、金相显微镜和X-射线衍射等分析测试手段对钎焊过程中所形成的反应产物和接头界面结构进行了分析。结果表明:接头界面形成了Ti(s.s)、Ag(s.s)、Ti-Cu金属间化合物等反应产物。连接温度较低(920℃)时,界面结构依次为1Cr18Ni9Ti/TiCu/Ag(s.s)+少量Ti_2Cu/Ti_2Cu/Ti_2Cu/Ti(s.s)/TC4;连接温度升高(960℃)时,界面结构为1Cr18Ni9Ti/Ti_2Cu/Ti_2Cu+Ag(s.s)/Ti_2Cu/Ti_2Cu+Ti(s.s)/TC4;连接温度较高(1000℃)时,界面结构为1Cr18Ni9Ti/TiCu_2/TiCu/Ti_2Cu/Ti_2Cu+Ti(s.s)/TC4。提高钎焊温度与延长保温时间对钎焊接头界面组织结构有相似的影响,各反应相、反应层逐渐长大,金属间化合物反应相所占比例增大,而Ag(s.s)组织所占的比例变得更小,这种趋势随着焊接工艺参数的提高更加明显。TCA titanium alloy and 1Crl8Ni9Ti stainless steel were brazed in vacuum by using Ag -Cu -Ti foil filler metals. The interface microstructure and phases of the brazed joints were studied with scanning electronic microscopy （SEM）, energy distribu- tion spectrometer （EDS）, X-ray diffraction （XRD） and metallographic microscope. The results show that the several kinds of in- termetallics such as Ti （s. s）, Ag （s. s）, Ti-Cu and so on are formed. The interfacial microstructure of the joint is 1Crl8Ni9Ti/ TiCu intermetallic compound/Ag （ s. s） ＋ Ti2 Cu /Ti2 Cu/Ti2 Cu ＋ Ti （ s. s）/TC4 at the lower brazing temperature of 920 ~C, 1 Crl8Ni9Ti/Ti2 Cu/Ag （ s. s ） ＋ Ti2 Cu/Ti2 Cu/Ti2 Cu/Ti2 Cu ＋ Ti （ s. s ）/TC4 at the brazing temperature of 960 ~C, and 1Cr18NigTi/TiCuJTiCu/Ti2Cu/Ti2Cu ＋ Ti （s. s）/TCA at the highest brazing temperature of 1 000 ~C respectively. The similar effects on the interface microstructure and phases of the joint are produced at higher brazing temperature or longer holding time. As brazing temperature is very high or holding time is very long, the depth of phase, the interfacial reactive layer and the ratio of intermetallic compound phase increase, but Ag （s. s） reduces evidently.

关 键 词：钛合金 不锈钢 钎焊 界面组织 

分 类 号：TG407[金属学及工艺—焊接]