环氧树脂含硅固化剂的固化动力学研究  

Study on Curing Kinetics of Silicon-containing Epoxy Curing Agent

作　　者：邸喜强[1] 翁睿[1] 姜艳琼[1] 

机构地区：[1]武汉理工大学材料科学与工程学院,武汉430070

出　　处：《武汉理工大学学报》2012年第11期18-21,共4页Journal of Wuhan University of Technology

基　　金：国家"863"项目(2003AA305071)

摘　　要：采用化学合成方法,利用甲苯-2,4-二异氰酸酯、羟基硅油和二乙胺合成了新型的环氧树脂含硅固化剂,使用红外光谱分析初步确定了合成固化剂的分子结构,通过差示扫描量热法(DSC)分析了合成固化剂/环氧树脂固化体系的固化动力学,并对固化制度进行了优化计算。采用分析固化动力学常用的Kissinger等分析方法,对体系表观活化能和反应级数进行了分析。计算结果表明,体系的表观固化活化能为57.07kJ/mol,反应级数为n=0.920 3。外推法得到体系理论凝胶温度Tgel=366.51K、最大固化速率温度Tcure=386.44K、后固化温度Ttreat=397.30K。The novel epoxy curing agent was synthesized by using toluen-2,4-diisocyanate, hydroxyl silicone oil, and diethylamine, then using infrared spectrum scan to determine the structure of the synthesis curing agent. Using DSC a nalysis, study on the curing kinetics of curing agent/epoxy, and optimized the curing system. Through the Kissingger method and other method, the apparent activation energy and the curing order of reaction was calculated. Results showed that, the apparent activation energy is 57.07 kJ/mol and the curing order of reaction is 0. 920 3. In the end, the curing process technology was researched. The theory gel temperature was Tgel =366.51 K, the curing rate maximum tempera- ture was Tcure =386.44 K and final treatment temperature was Ttreat, =397.30 K.

关 键 词：合成固化剂 环氧树脂 DSC分析 固化动力学 

分 类 号：O643.1[理学—物理化学]