一种新型陶瓷用耐高温胶粘剂的研制与性能研究  

Study on the Preparation and Performance of a Novel High Temperature Resistant Adhesive for Bonging Ceramic Materials

作　　者：董柳杉[1] 罗瑞盈[1] 

机构地区：[1]北京航空航天大学物理科学与核能工程学院,北京100191

出　　处：《表面技术》2012年第6期58-61,98,共5页Surface Technology

基　　金：国家自然科学基金项目(21071011)

摘　　要：用有机硅树脂、KH560改性的纳米SiO2改性,并用无机填料(铝粉、玻璃粉、碳化硼)增强环氧树脂基体,制备了一种用于Al2O3陶瓷的新型耐高温胶粘剂。红外和热重分析表明,胶粘剂可在65℃固化,且耐热性较好。通过正交试验,优化了各原料的配比,根据优化配比制备的耐高温胶粘剂可使Al2O3陶瓷接头在经过1000℃高温处理后,剪切强度达到9.68 MPa。A new high temperature resistant adhesive that was epoxy resin modified by silicone resin and KH560 modi- fied nano-SiO2 and reinforced by inorganic filler （ aluminum powder, glass powder, boron carbide） was prepared for bonding ceramic （ A1EO3 ） materials. The analysis of IR and TG shows that the adhesive can be cured at 65℃ and has good heat resist- ance. Through orthogonal experiment, it optimizes the ratio of every raw material. The adhesive which was prepared according to the optimum experiment ratio can bond ceramic （A12O3 ） joints well, and the compressive shear strength of ceramic joints can reach 9.68 MPa after heat treatment at 1000℃.

关 键 词：耐高温胶粘剂 陶瓷材料 压剪强度 

分 类 号：TQ437[化学工程]