C/C复合材料表面双层辉光等离子制备铼涂层研究  

Study of Re Coating Deposited on C/C Substrate by Double-Glow Plasma

作　　者：华云峰[1] 李争显[1] 黄春良[1] 杜继红[1] 骆瑞雪[1] 

机构地区：[1]西北有色金属研究院,陕西西安710016

出　　处：《稀有金属材料与工程》2012年第11期2013-2016,共4页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(51102197)

摘　　要：用双层辉光等离子渗金属技术,在C/C复合材料基体表面制备了铼涂层,研究了铼涂层显微结构、相组成、硬度以及结合强度。结果表明,铼涂层致密光滑,由多晶结构的柱状晶粒组成,晶粒尺寸在0.5～1.5μm之间。涂层(110)和(103)晶面发生了择优生长。涂层HV显微硬度为6.66±0.25GPa。制备过程中涂层与基体发生互扩散,界面既有机械结合又有物理结合。划痕试验加载过程中,当C/C复合材料基体由于硬度和韧性低而发生破碎后,铼涂层与基体仍结合良好。The Re coating was deposited on C/C substrates by double-glow plasma technique.The microstructure,phases,Vickers hardness and interfacial bonding strength of the coating were studied.The results show that the Re coating is composed of poly-crystalline column structural grains with preferential growth orientation of（110） and（103） crystal plane.The Re coating is dense and smooth,and the size of grains ranges from 0.5 μm to 1.5 μm.The Vickers hardness of the Re coating is 6.66±0.25 GPa.The Re coating and C/C substrates inter-diffuses with each other during preparation and there is mechanical bonding and physical bonding in the interface.During the loading process of the scratch tests,the interfacial bonding strength between Re coating and C/C substrates is high even when the C/C substrate is broken due to the low hardness and ductility.

关 键 词：双层辉光等离子 铼涂层 C C复合材料 显微结构 结合强度 

分 类 号：TB306[一般工业技术—材料科学与工程]