单组分有机硅导电涂料的制备及其性能研究  

Preparation and properties of one component organic silicon conductive coatings

作　　者：常侠[1] 聂小安[1] 陈洁[1] 许彬[1] 李科[1] 

机构地区：[1]中国林业科学研究院林产化学工业研究所,生物质化学利用国家工程实验室,国家林业局林产化学工程重点开放性实验室,江苏省生物质能源与材料重点实验室,江苏南京210042

出　　处：《热固性树脂》2012年第6期40-43,共4页Thermosetting Resin

基　　金：国家"十二五"科技支撑项目(2012BAD32B03);浙江省与中国林业科学研究院省院合作项目(2010SY05)资助

摘　　要：以耐高温有机硅为基体,银包铜粉为填料制备了一种导电涂料,通过对其涂膜的体积电阻率、附着力、冲击强度、粘度测试和TG分析,研究了银包铜粉含量对导电涂料电性能、物理力学性能的影响以及该涂料的适用期、耐热性和耐老化性。结果表明,当银包铜粉质量分数为导电涂料的60%时,产物体积电阻率可达6.27×10-4Ω·cm,附着力一级,冲击强度>50 kg·cm,常温8 h内粘度可保持在6.0 Pa·s,固化物热分解温度高达532.7℃,并具有优良耐老化性。The conductive coatings was prepared by using heat resistant organosilicon as matrix and silver-coated copper powder as filler.The effect of silver-coated copper powder contents on the electrical properties,physical and mechanical properties of the coatings,pot life of the coatings,heat resistance and aging resistance of the coatings were investigated by the testings of volume resistivity,adhesion,impact strength and viscosity and TG analysis.The results showed that the properties of coatings with 60% silver-coated copper powder were as follows：volume resistivity 6.27×10^-4 Ω · cm,adhesion 1 level,impact strength〉50 kg · cm,viscosity maintained in 6.0 Pa · s at room temperature for 8 h,thermal decomposition temperature of cured product 532.7 ℃ and excellent aging resistance.

关 键 词：单组分 有机硅 银包铜粉 导电涂料 制备 体积电阻率 耐热 

分 类 号：TQ637[化学工程—精细化工]