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作 者:庞翔[1] 张彩虹[1] 童启铭[1] 肖勇[1] 李攀敏[1] 袁颖[1]
机构地区:[1]电子科技大学电子薄膜与集成器件国家重点实验室,四川成都610054
出 处:《压电与声光》2012年第6期908-911,共4页Piezoelectrics & Acoustooptics
摘 要:采用化学旋蒸工艺,制备了无定形SiO2填充聚四氟乙烯(PTFE)复合材料,并对其进行了热、介电性能测试和SEM分析表征。系统研究了PTFE-SiO2复合介质材料中,不同粒径的SiO2(4μm,9μm,13μm,20μm)对材料结构和性能的影响。结果表明,复合材料的密度、热膨胀系数、介电常数随着SiO2粒径的增大而增加,而介电损耗则随着SiO2粒径的增大而减小。当SiO2的粒径为20μm时,PTFE能很好的在SiO2表面形成一层包覆层,此时复合材料具有合适的热膨胀系数(17.58×10-6/℃)、介电常数(2.82)和低介电损耗(0.001 2)。The amorphous SiO2 filled PTFE composite material were prepared by using the chemical rotary steam. The thermal and dielectric properties of the composites were measured. Also, the microstructure evolution of the composites was characterized by the Scanning electron microscopy (SEM). The effects of SiO2 with different grain size (Ф4 μm,Ф9 μm, Ф13 μm and Ф20 μm) on the microstructure and dielectric properties for PTFE-SiO2 composite dielectric material were investigated. It was found that the density, the thermal expansion coefficient and dielectric constant increased with the grain size SiO2 increase, while the dielectric loss was decreased with the grain size of SiO2 increase. When the grain size of SiO2 was Ф20μm, PTFE could be well coated on the SiO2 layers, and the composites exhibited proper thermal expansion coefficient (17.58 × 10 ^-6/℃), dielectric constant (2.82) and low dielectric loss (0. 001 2).
关 键 词:复合材料 SIO2 聚四氟乙烯(PTFE) 热膨胀系数 介电性能
分 类 号:TQ327.9[化学工程—合成树脂塑料工业]
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