室温固化环氧胶粘剂的研究现状与发展趋势  

The Research Present State and the Development Trend of Two Part Room Temperature Curing Epoxy Adhesives

作　　者：陈维君[1] 张恩天[1] 郭旭[1] 张淑芳[1] 

机构地区：[1]黑龙江省石油化学研究院,黑龙江哈尔滨150040

出　　处：《化学与粘合》2000年第3期127-129,133,共4页Chemistry and Adhesion

摘　　要：本文综述了双组分室温固化环氧树脂胶粘剂的发展过程与研究现状 ,介绍了近年来国内外几种性能优异的室温固化环氧胶粘剂 ,指出双组分室温固化型环氧胶的发展趋势是耐高温、高强度、高耐久性及快速固化。In this paper,the research present state and the development trend of two part room temperature curing epoxy adhesives were summarized.A few excellent adhesives sold inside and outside China were introduced.It is indicated that the current development trend for this kind of adhesives is high temperature resistance,high strength,high endure and fast curing.

关 键 词：室温固化 环氧 结构胶粘剂 研究与发展 

分 类 号：TQ433.437[化学工程]